By Doi, Toshiro; Marinescu, Ioan D.; Kurokawa, Syuhei(eds.)
CMP and sharpening are the main designated procedures used to complete the surfaces of mechanical and digital or semiconductor parts. This ebook offers the most recent advancements and technological suggestions within the box, making state of the art R&D obtainable to the broader engineering neighborhood. lots of the purposes of those tactics are stored as personal as attainable (proprietary information), and particular info are usually not obvious in specialist or technical journals and magazines. This ebook makes those techniques and functions obtainable to a much wider business and educational viewers. construction at the basics of tribology, the technological know-how of friction, put on and lubrication, the authors discover the sensible purposes of CMP and sprucing throughout a number of marketplace sectors. as a result excessive velocity of improvement of the electronics and semiconductors undefined, the various provided strategies and purposes come from those industries.
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Additional info for Advances in CMP/Polishing Technologies for the Manufacture of Electronic Devices
These are used in pumps, compressors and turbines to prevent leakage in the rotating components. Such seals need excellent accuracy, hence manufacturing them by hand lapping was an arduous task. 15 Schematic of lapping process necessity for motorized lapping machines for delivering fast and consistent results. 2 Lapping Mechanism The fundamental principle of lapping consists of transferring the flatness of the lapping plate to the work piece. This is achieved when abrasive grains in a liquid vehicle called a slurry are guided across a work piece by means of a rotating tool or plate.
Lapping both sides of a work piece on a single-sided lapping machine needs the work piece to be turned and requires skilled workmanship. This is highly undesirable in mass production processes due to the time factor involved. Hence double-sided lapping machines were developed. 2 Mechanism In double-sided lapping, the lapping abrading mechanism is applied to both sides of the work piece simultaneously. The work pieces are held in position by steel or plastic carriers, and sandwiched between two rotating plates.
Watanabe et al. 8). They fabricated solar cells using these wafers and studied their electrical characteristics. From these experiments, they showed that wafers sliced with a fixed-abrasive wire with resin-bonded diamond grit have a saw-damage layer that is more than a factor of two thinner than those of wafers sliced with a loose-abrasive wire. They also argued that fixed-abrasive wires with resin-bonded diamond grit are suited for the fabrication of solar cells, particularly thin silicon cells where wafer thicknesses approach or become less than 150 mm.